Tray Multiprotocol Modules

Rezultatai: 159
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Qty. RoHS ECAD modelis Serija
Dažnis
Išvesties Galia
Interface Type
Maitinimo Įtampa - Min.
Maksimali Maitinimo Įtampa
Minimali darbinė temperatūra
Didžiausia darbinė temperatūra
Antenos jungties tipas
Matmenys
Protokolas – „Bluetooth“, BLE – 802.15.1
Protokolas – korinis, NBIoT, LTE
Protokolas – GPS, GLONASS
Protokolas – „WiFi“ – 802.11
Protokolas – ANT, „Thread“, „Zigbee“ – 802.15.4
Pakavimas

Silicon Labs Multiprotocol Modules Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm
Duomenų Lapas
1 342Prieinamumas
Min.: 1
Daugkart.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
u-blox Multiprotocol Modules M.2 card with JODY-W263, in tray
Duomenų Lapas
197Prieinamumas
Min.: 1
Daugkart.: 1

JODY-W2 2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.2 Tray
Microchip Technology Multiprotocol Modules ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Duomenų Lapas
2 252Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Ezurio Multiprotocol Modules Module, Sterling LWB+, M.2, Key E, SDIO, UART CYW43439
Duomenų Lapas
60Prieinamumas
Min.: 1
Daugkart.: 1

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Microchip Technology Multiprotocol Modules ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna
Duomenų Lapas
840Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Ezurio Multiprotocol Modules 60 Series, Sterling Module w/u.FL, PCIE/UART, (NXP Cortex A5, 88W8997, 88PG823)
Duomenų Lapas
195Prieinamumas
Min.: 1
Daugkart.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Duomenų Lapas
17Prieinamumas
Min.: 1
Daugkart.: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Silicon Labs Multiprotocol Modules 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Duomenų Lapas
772Prieinamumas
Min.: 1
Daugkart.: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Pulse Electronics Multiprotocol Modules USB 802.11 b/g/n BT module
746Prieinamumas
Min.: 1
Daugkart.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silicon Labs Multiprotocol Modules MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Duomenų Lapas
260Prieinamumas
Min.: 1
Daugkart.: 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Microchip Technology Multiprotocol Modules Bluetooth LE and 802.15.4 module, 2MB Flash, 512KB RAM, 82LD, u.FL connector
Duomenų Lapas
295Prieinamumas
Min.: 1
Daugkart.: 1
16 MHz - 108 dBm, - 102 dBm, - 98 dBm, - 95 dBm I2C, SPI, USART 1.9 V 3.6 V - 40 C + 85 C U.FL 19 mm x 25 mm x 2.75 mm Bluetooth 802.15.4 Tray
Telit Cinterion Multiprotocol Modules 116Prieinamumas
Min.: 1
Daugkart.: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Telit Cinterion Multiprotocol Modules 292Prieinamumas
Min.: 1
Daugkart.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion Multiprotocol Modules 374Prieinamumas
Min.: 1
Daugkart.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion Multiprotocol Modules 392Prieinamumas
Min.: 1
Daugkart.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Microchip Technology Multiprotocol Modules ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna
Duomenų Lapas
65Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Sierra Wireless Multiprotocol Modules 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35
Duomenų Lapas
153Prieinamumas
200Tikėtina 2026-07-22
Min.: 1
Daugkart.: 1

USB 3.135 V 4.4 V Tray
InnoPhase IoT Multiprotocol Modules WiFi/BLE5/MCU Module w/ U.FL Antenna Connector
Duomenų Lapas
396Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 19.1 mm x 21.6 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, voice + data application, North America, mPCIe form factor
Duomenų Lapas
99Prieinamumas
Min.: 1
Daugkart.: 1

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
InnoPhase IoT Multiprotocol Modules WiFi/BLE5/MCU Module w/ PCB Antenna
Duomenų Lapas
171Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 19.1 mm x 21.6 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type.
Duomenų Lapas
100Prieinamumas
Min.: 100
Daugkart.: 100

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
CEL Multiprotocol Modules 88W9098 IC, WiFi6 2x2 + BT 5.1, M.2, 3x MHF4 Connectors
Duomenų Lapas
206Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz, 5 GHz 18 dBm PCIe, UART 3.14 V 3.46 V - 40 C + 85 C MHF4 30 mm x 28 mm x 3.65 mm Bluetooth 5.2 Tray
Telit Cinterion Multiprotocol Modules WE310F5-I (Wi-Fi b/g/n + BLE) 39.00.008
Duomenų Lapas
390Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Bluetooth 802.11 b/g/n Tray
Telit Cinterion Multiprotocol Modules WE310F5-P (Wi-Fi b/g/n + BLE) 39.00.008
Duomenų Lapas
452Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm x 2.6 mm Bluetooth 802.11 b/g/n Tray
Telit Cinterion Multiprotocol Modules WE310K6-P EXT ANT
Duomenų Lapas
391Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz/5 GHz 5 dBm, 8 dBm, 19 dBm PCIe, PCM, UART 3.3 V - 40 C + 85 C RF 18 mm x 15 mm x 2.6 mm Bluetooth 802.11 a/b/g/n/ac/ax Tray