Infineon Technologies REF-10KW-3LBUCK-SIC400 Reference Board

Infineon Technologies REF-10KW-3LBUCK-SIC400 Reference Board uses a 3-level-flying capacitor Buck DC/DC converter, which can also be reconfigured to be used as a 2-level Buck DC/DC converter. The primary goal of the platform is to enable evaluation of CoolSiC™ MOSFET 400V/650V G2 in TOLL and D2PAK-7 packages. This reference design also aims to provide layout guidelines to optimize the commutation and gate loops. The Infineon Technologies board provides solutions for auxiliary supplies for floating gate-drive, startup, pre-charging, and voltage balancing of the flying capacitor in multi-level topologies.

Features

Platform to evaluate CoolSiC™ 400V or 650V MOSFETs G2, benchmarking 3L vs 2L topologies by shorting outer leg MOSFETs QHSO and QLSO for 2L operation
Flying capacitor balancing algorithm
Low-cost and low-space discrete planar-transformer-based isolated auxiliary gate drive supply for 4x HF leg MOSFETs
Support for testing bipolar vs. unipolar gate drive with adjustable driving voltage
Gate drive is selectable with respect to Kelvin-Source (KS 4-terminal drive) or Power-Source (PS 3-terminal drive)
Low commutation and gate-loop inductance in a high-power design with a heatsink for cooling

Onboard components
- REF_10KW_3LBUCK_SiC400 – main board with 3-level-flying capacitor Buck DC/DC converter, with CoolSiC MOSFET 400V G2 IMT40R011M2H
- CoolSiC MOSFET 650V G2 IMT65R010M2H (included)
- XMC™ control card using XMC4400F100F512BA (included)
- XMC Link Segger debugger/programmer (not included)
- Würth Elektronik inductors 760801122 (assembled) for 3-level and 760801102 (not assembled) for 2-level Buck DC/DC converter operation
- TDK stacked MLCCs CKG57NX7T2W225M500JH for flying capacitors (assembled)
- Bando TS103 100mm x 100mm, 1.0mm thick HeatEX thermal interface material (assembled)
- Assembly test report and safety guidelines