RISC Šerdis RD integriniai grandynai

RF integrinių grandynų tipai

Pakeisti kategorijos rodinį
Rezultatai: 52
Pasirinkite Vaizdas Dalies Nr. Gam. Aprašymas Duomenų Lapas Prieinamumas Kainodara (EUR) Filtruokite lentelėje pateiktus rezultatus pagal vieneto kainą, remdamiesi kiekiu. Qty. RoHS
Telink RD sistema luste – SoC BLE 5.0, AoA/Tx, Telink Mesh, 32 pin QFN
2 302Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.1, AoA/Tx, Telink Mesh, 2.4G Proprietary, 48 pin QFN
2 500Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.0, AoA/Tx, Telink Mesh, 24 pin QFN
2 955Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.0, AoA/Tx, Telink Mesh, 48 pin QFN
2 856Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.1, AoA/Tx, Telink Mesh, 2.4G Proprietary, 32 pin QFN
2 670Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.0, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 48 pin QFN
2 144Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE4.2 compliant, BLE5.0 2Mbps and long packet length, 24 pin QFN
2 900Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.0, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 32 pin QFN
2 776Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.0, AoA/Tx, BLE Mesh, RF4CE, 32 pin QFN
2 138Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

NXP Semiconductors RD mikrovaldikliai – MCU ZigBee and IEEE802.15.4 wireless microcontroller with 512 kB Flash, 32 kB RAM 768Prieinamumas
Min.: 1
Daugkart.: 1
: 1 000

Telink RD sistema luste – SoC BLE4.2 compliant, BLE5.0 2Mbps and long packet length, 24 pin QFN
2 559Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.1, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 48 pin QFN
2 970Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC 2.4G Proprietary, 32 pin QFN
2 715Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC 2.4G ESL/RFID, 32 pin QFN
2 951Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC 2.4G 16K OTP, 8K SRAM
4 929Prieinamumas
Min.: 1
Daugkart.: 1
: 5 000

Telink RD sistema luste – SoC BLE 5.0, AoA/Tx, BLE Mesh, RF4CE, 32 pin QFN
2 972Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.1, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 48 pin QFN
2 466Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC Multi-protocol Connectivity SoC, 1MB Flash, temp -40? to 85?, 48 Pin Bluetooth LE 5.2, Bluetooth Mesh, AoA/AoD, 6LoWPAN/Thread, 802.15.4, Zigbee, HomeKit, Find My, Matter, 2.4G Proprietary, RTOS PSA Level 1 Certified 2 752Prieinamumas
Min.: 1
Daugkart.: 1
Telink RD sistema luste – SoC Multi-protocol Connectivity SoC, 2MB Flash, temp -40? to 105?, 48 Pin Bluetooth LE 5.2, Bluetooth Mesh, AoA/AoD, 6LoWPAN/Thread, 802.15.4, Zigbee, HomeKit, Find My, Matter, 2.4G Proprietary, RTOS PSA Level 1 Certified 2 940Prieinamumas
Min.: 1
Daugkart.: 1
Telink RD sistema luste – SoC BLE 5.0, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 32 pin QFN
2 484Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE4.2 compliant, BLE5.0 2Mbps and long packet length, 32 pin QFN
2 964Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC 2.4G Proprietary, 48 pin QFN
5 995Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC BLE 5.0, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 32 pin QFN
2 133Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Telink RD sistema luste – SoC 2.4G Proprietary, 24 pin QFN
2 944Prieinamumas
Min.: 1
Daugkart.: 1
: 3 000

Espressif Systems RD sistema luste – SoC ESP32-S3 is a low-power MCU-based system on a chip (SoC) with integrated 2.4 GHz Wi-Fi and Bluetooth Low Energy (Bluetooth LE). It consists of high-performance dual-core microprocessor (Xtensa 32-bit LX7), a low power coprocessor, a Wi-Fi baseband, 1 170Prieinamumas
2 000Tikėtina 2026-11-26
Min.: 1
Daugkart.: 1