Multiprotocol Modules

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Qty. RoHS ECAD modelis Serija
Dažnis
Išvesties Galia
Interface Type
Maitinimo Įtampa - Min.
Maksimali Maitinimo Įtampa
Minimali darbinė temperatūra
Didžiausia darbinė temperatūra
Antenos jungties tipas
Matmenys
Protokolas – „Bluetooth“, BLE – 802.15.1
Protokolas – korinis, NBIoT, LTE
Protokolas – GPS, GLONASS
Protokolas – Sub GHz
Protokolas – „WiFi“ – 802.11
Protokolas – ANT, „Thread“, „Zigbee“ – 802.15.4
Kvalifikacija
Pakavimas
Espressif Systems Multiprotocol Modules 2.4 GHz, Wi-Fi and Bluetooth 5, 14 GPIOs, QFN-24, RISC-V Single-Core CPU
Duomenų Lapas
4 930Prieinamumas
Min.: 1
Daugkart.: 1

Telit Cinterion Multiprotocol Modules 170Prieinamumas
Min.: 1
Daugkart.: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Telit Cinterion Multiprotocol Modules 382Prieinamumas
Min.: 1
Daugkart.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion Multiprotocol Modules 392Prieinamumas
Min.: 1
Daugkart.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Intel AX211.NGWG.NV
Intel Multiprotocol Modules Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro
Duomenų Lapas
423Prieinamumas
Min.: 1
Daugkart.: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Intel AX210.NGWGIE.NV99ARN4
Intel Multiprotocol Modules Intel Wi-Fi 6E AX210 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, Embedded, No vPro 152Prieinamumas
Min.: 1
Daugkart.: 1

Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Duomenų Lapas
6Prieinamumas
Min.: 1
Daugkart.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Intel Multiprotocol Modules Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Duomenų Lapas
28Prieinamumas
Min.: 1
Daugkart.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Duomenų Lapas
6Prieinamumas
Min.: 1
Daugkart.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Insight SiP Multiprotocol Modules nRF52832 LoRa Transceiver & BLE 5 Module AS
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69Prieinamumas
Min.: 1
Daugkart.: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
M5Stack Multiprotocol Modules a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash
Duomenų Lapas
7Prieinamumas
10Tikėtina 2026-03-20
Min.: 1
Daugkart.: 1

I2C 25.93 mm x 18 mm x 4.7 mm
Pulse Electronics Multiprotocol Modules USB 802.11 b/g/n BT module
746Prieinamumas
Min.: 1
Daugkart.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silicon Labs Multiprotocol Modules Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Duomenų Lapas
18Prieinamumas
Min.: 1
Daugkart.: 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
u-blox Multiprotocol Modules 88W8887, 802.11ac+BT, 1 antenna pin
Duomenų Lapas
278Prieinamumas
Min.: 1
Daugkart.: 1
Reel: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C External 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel, Cut Tape
HMS Networks Multiprotocol Modules Wireless Bolt-CAN Interface
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Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Intel Multiprotocol Modules Intel Wi-Fi 6 AX200, 1216, 2x2 AX+BT, No vPro , LTE Coex, UART
Duomenų Lapas
490Prieinamumas
Min.: 1
Daugkart.: 1

Wi-Fi 6 AX200 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 LTE 802.11 ax
CEL Multiprotocol Modules CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
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2Prieinamumas
Min.: 1
Daugkart.: 1

CMP9670 PCIe, USB Bluetooth Bulk
Silex Technology Multiprotocol Modules [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Duomenų Lapas
15Prieinamumas
Min.: 1
Daugkart.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Seeed Studio Multiprotocol Modules The factory is currently not accepting orders for this product. 188Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Duomenų Lapas
253Prieinamumas
97Tikėtina 2026-04-29
Min.: 1
Daugkart.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Ezurio Multiprotocol Modules RF Module, Sterling LWB+, Chip Antenna, CutTape CYW43439
Duomenų Lapas
154Prieinamumas
1 000Tikėtina 2026-08-11
Min.: 1
Daugkart.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Silicon Labs Multiprotocol Modules Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Duomenų Lapas
99Prieinamumas
Min.: 1
Daugkart.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio Multiprotocol Modules RF Module, Sterling LWB+, MHF4, Cut Tape CYW43439
Duomenų Lapas
75Prieinamumas
Min.: 1
Daugkart.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Lantronix Multiprotocol Modules BOLERO43 - EMEA - LTE CAT-M1 band 20, 8, 3, 7- 2G FB band 8, 3 - IP 67 GNSS - LI ON BATTERY BACKUP - RS232 - 10 WIRE AS FOLLOW - 2 WIRES - 2 I/O - 1 WIRE INTERFACE - CAN BUS SUPPORT - AVL SOFTWARE.
Duomenų Lapas

BOLERO RS-232 10.8 V 48 V LTE Cat-M1 GNSS Bulk
Intel Multiprotocol Modules Intel Wi-Fi 6 AX101, 2230, 1x1 AX+BT, No vPro
Duomenų Lapas
63Prieinamumas
Min.: 1
Daugkart.: 1

Wi-Fi 6 AX101 22 mm x 30 mm x 2.4 mm Bluetooth 802.11 ax