Multiprotocol Modules

Multiprotocol Modules
Multiprotocol Modules are in stock with same-day shipping at Mouser from industry leading manufacturers. Mouser is an authorized distributor for many bluetooth module manufacturers including Ezurio, Fanstel, Infineon, Insight SIP, Microchip, Silicon Labs, u-blox & more.
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Please view our large selection of Multiprotocol Modules below.
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Qty. RoHS ECAD modelis Serija
Dažnis
Išvesties Galia
Interface Type
Maitinimo Įtampa - Min.
Maksimali Maitinimo Įtampa
Minimali darbinė temperatūra
Didžiausia darbinė temperatūra
Antenos jungties tipas
Matmenys
Protokolas – „Bluetooth“, BLE – 802.15.1
Protokolas – korinis, NBIoT, LTE
Protokolas – GPS, GLONASS
Protokolas – Sub GHz
Protokolas – „WiFi“ – 802.11
Protokolas – ANT, „Thread“, „Zigbee“ – 802.15.4
Kvalifikacija
Pakavimas
Texas Instruments Multiprotocol Modules TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1831MODGBMOCT
Duomenų Lapas
1 232Prieinamumas
„MouseReel“ galima
Min.: 1
Daugkart.: 1
: 1 200

WL1831MOD 2.4 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 70 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Advantech Multiprotocol Modules AX210 6E 802.11ax+BT5.2 vpo module+anten
Duomenų Lapas
290Prieinamumas
Min.: 1
Daugkart.: 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Advantech Multiprotocol Modules Wi-Fi 5 + BT Module 24/5GHz Mini PCIe
Duomenų Lapas
108Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C SMA 26.65 mm x 29.85 mm x 3.25 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Duomenų Lapas
5Prieinamumas
Min.: 1
Daugkart.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Duomenų Lapas
2Prieinamumas
Min.: 1
Daugkart.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Intel Multiprotocol Modules Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
Duomenų Lapas
57Prieinamumas
Min.: 1
Daugkart.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Advantech Multiprotocol Modules Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, M.2 2230 E key (Wi-Fi: PCIe/BT:USB)
Duomenų Lapas
1Prieinamumas
4Tikėtina 2026-07-16
Min.: 1
Daugkart.: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 BLE 5.3 802.11 b/g/n/ac/ax/be, WiFi 7
Intel AX211.NGWG.NV
Intel Multiprotocol Modules Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro
Duomenų Lapas
318Prieinamumas
Min.: 1
Daugkart.: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Pulse Electronics Multiprotocol Modules USB 802.11 b/g/n BT module
746Prieinamumas
Min.: 1
Daugkart.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Microchip Technology Multiprotocol Modules ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Duomenų Lapas
130Prieinamumas
Min.: 1
Daugkart.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
HMS Networks Multiprotocol Modules Wireless Bolt-CAN Interface
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Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Silex Technology Multiprotocol Modules [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Duomenų Lapas
15Prieinamumas
Min.: 1
Daugkart.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Ezurio Multiprotocol Modules Module, Vela IF310, Integrated Antenna, Cut Tape
Duomenų Lapas
229Prieinamumas
Min.: 1
Daugkart.: 1
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Cut Tape
Ezurio Multiprotocol Modules Module, Vela IF310, MHF4, Cut Tape
Duomenų Lapas
250Prieinamumas
Min.: 1
Daugkart.: 1
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Cut Tape
Ezurio Multiprotocol Modules Module, Vela IF310, Trace Pin, Cut Tape
Duomenų Lapas
250Prieinamumas
Min.: 1
Daugkart.: 1
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Cut Tape
Silex Technology Multiprotocol Modules [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Duomenų Lapas
10Prieinamumas
Min.: 1
Daugkart.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Ezurio Multiprotocol Modules Sterling-LWB SIP, Cut Tape
Duomenų Lapas
474Prieinamumas
Min.: 1
Daugkart.: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C RF 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape
Ezurio Multiprotocol Modules Sterling LWB+, MHF4, Cut Tape
Duomenų Lapas
Ne Sandėlyje Esančių Prekių Pristatymo Laikas 26 Savaičių
Min.: 1
Daugkart.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape


ADLINK Technology Multiprotocol Modules AMPAK AP12356 WIFI/BT KIT 2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini CardIEEE802.11a/b/g/n/ac, PCI-e interfaceOperating Temperature: -10 70? Driver for Win/Linux/Android2pcs x Antenna + 2pcs x IPEX cable 2Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz, 5 GHz 16 dBm PCIe, USB 3 V 3.6 V - 10 C + 70 C External Bluetooth 802.11 a/b/g/n/ac
AcSiP Multiprotocol Modules AI7931LD - Multiprotocol Modules WIFI6 Dual Band 2.4/5GHz M33 SoC Module
Duomenų Lapas
122Prieinamumas
Min.: 1
Daugkart.: 1

WIFI 300 MHz ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART 2.97 V 3.63 V - 40 C + 85 C 32 mm x 32 mm x 2.7 mm Bluetooth 5.0 802.11 a/b/g/n/ac/ax Bag
Silicon Labs Multiprotocol Modules Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Duomenų Lapas
99Prieinamumas
Min.: 1
Daugkart.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
DFRobot Multiprotocol Modules ESP32-C3-MINI-1-N4 Module (PCB antenna)
27Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Seeed Studio Multiprotocol Modules The factory is currently not accepting orders for this product. 187Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Fortebit Multiprotocol Modules Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable.
Duomenų Lapas
5Prieinamumas
Min.: 1
Daugkart.: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
DFRobot Multiprotocol Modules ESP32-C3-WROOM-02-N4 Module (PCB antenna) 26Prieinamumas
Min.: 1
Daugkart.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n