Texas Instruments EVM-LEADLESS1 DIP Header Adapter Board
Texas Instruments EVM-LEADLESS1 DIP Header Adapter Board allows for quick testing and breadboarding of TI's standard leadless packages. The adapter board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW, RTE, RTJ, RUK, RUC, RUG, RUM, RUT, and YZP surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows surface mount packages to be plugged into a 100mil spaced breadboard
- Supports TI's sixteen most popular leadless packages with a single panel
Associated Product
Texas Instruments TS3A225E Autonomous Audio Headset Switch
Automatically connects a microphone line to the appropriate pin.
Texas Instruments TS3A26746E 2x2 Crosspoint Switch
Interchanges Ground and MIC connections on a headphone connector.
Paskelbta: 2018-07-09
| Atnaujinta: 2022-11-14