ROHM Semiconductor BST500D08P4A1x4 TRCDRIVE pack™ with Molded Modules
ROHM Semiconductor BST500D08P4A104 and BST500D08P4A114 TRCDRIVE pack™ with 2-in-1 SiC Molded Modules provide 750V rated voltage in a 41.6mm × 52.5mm package designed to significantly reduce the size of electric vehicle (xEV) inverters. These compact, power-dense modules integrate 4th Generation SiC MOSFETs and support up to 300kW. The unique terminal configuration addresses the key challenges of traction inverters regarding higher efficiency, miniaturization, and fewer person-hours. ROHM Semiconductor BST500D08P4A104 and BST500D08P4A114 modules provide ease of use for designers and do not require soldering for the signal terminals.
Features
- Combination of press-fit pins and molding technology results in smaller design
- High power density due to higher heat dissipation and lower stray inductance
- Ease of use, including no soldering for signal terminals
- Discrete packaging production system for high productivity
- Designed for automotive traction inverters
- AQG 324 qualified
Specifications
- 750VDSS maximum voltage
- 506A maximum DC current
- Maximum AC current
- BST500D08P4A104: 417A
- BST500D08P4A114: 429A
- 2mΩ maximum RDS(on)
- Heat sink assembly
- BST500D08P4A104: TIM: heat dissipation sheet
- BST500D08P4A114: Ag sinter
- 41.6mm × 52.5mm dimensions
TRCDRIVE pack
Power-Dense Design
Related Modules
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Features 1200V rated voltage in 41.6mm × 52.5mm package and integrates 4th Generation SiC MOSFETs.
ROHM Semiconductor BST740D08P4A1x4 TRCDRIVE pack™ with Molded Modules
Features 750V rated voltage in 58.6mm x 52.5mm package to help reduce the size of xEV inverters.
ROHM Semiconductor BST580D12P4A1x1 TRCDRIVE pack™ with Molded Modules
Offers 1200V rated voltage and integrates 4th Generation SiC MOSFETs in a 58.6mm x 52.5mm package.
Paskelbta: 2024-06-19
| Atnaujinta: 2024-06-19