TechNexion PICO-IMX8M SOM

TechNexion PICO-IMX8M SOM is a PICO System-on-Module based on the NXP Semiconductors i.MX8M Quad Core Cortex®-A53 + M4 Processor clocking up to 1.5GHz. The PICO-IMX8M also includes up to 4GB of LPDDR4 memory, 16GB eMMC, and Wi-Fi®/BLUETOOTH® connectivity. The PICO-IMX8M SOM is a purpose-built, small-footprint hardware platform equipped with a wide array of high-speed connectivity engineered to support IoT endpoints, wearable applications, appliances, drones, or industrial mobile terminals.

The TechNexion PICO-IMX8M SOM operates in both commercial and industrial temperature ranges from -40°C to +85°C. The onboard Vivante™ GC7000Lite GPU supports a full-HD MIPI DSI display and a MIPI-CSI2 Camera. The OpenCL GPU accelerator brings up to 32 GOPS AI/ML capabilities to IIoT edge devices.

Features

Core system
- NXP Semiconductors i.MX8M Quad Applications Processor
  - Arm Cortex-A53 + M4
  - Up to 1.5GHz processor speed
- Up to 4GB LPDDR4
- 16GB eMMC
- ROHM Semiconductor BD71837 PMIC
- Edison-compatible PICO 70-pin connectors
Connectivity
- RGMII network LAN
- Qualcomm QCA9377 Wi-Fi/Bluetooth
  - 802.11 a/b/g/n/ac (2.4GHz + 5GHz) + BT (BR+EDR+BLE)
  - MHF4 antenna connector
Video
- Vivante GC7000Lite graphic engine
- 4K UltraHD HDR 4Kp60 H.265 VP9 video decode
Audio
- Audio codec on carrier board
- I²C 2-channel audio interface
Operating system support
- Linux
- Yocto
- Android

Certification and compliance
- USA: FCC ID 2AKZA-QCA9377
- Canada: IC 22364-QCA9377
- Japan: TELEC 201-180629
- European Union:
- EN 55032 / EN 55024
- EN 300 328 v2.1.1
- EN 301 893 v2.1.1
- Australia/New Zealand: RCM
- Bluetooth: Bluetooth 4.2
- Compliant with RoHS and REACH directives
Environmental and mechanical
- Dimensions: 37mm x 40mm
- Form factor: PICO Compute Module
- Weight: 8g
- Operating temperature range
  - Commercial: 0°C to +60°C
  - Industrial: -35°C to +85°C
- Relative humidity: 10% to 90%
- MTBF: >100,000 hours
- Shock: 50G/25ms
- Vibration: 20G/0Hz to 600Hz
- Power input: 4.25V to 5.25V_DC