TE Connectivity IMPACT™ High Density Backplane Connectors
TE Connectivity's IMPACT™ Connector System meets the increased speed and density requirements of future system upgrades and next generation data networking and telecommunications equipment. TE's IMPACT High Density Backplane Connectors feature unique broad-edge coupled design which utilizes low impedance and a localized ground return path in an optimized differential pair array. The differential pairs are tightly coupled at 80 pairs per linear inch, and are surrounded by ground structures to isolate the pairs. This innovative design enables the IMPACT High Density Backplane Connectors to achieve data rates up to 25Gb/s, reduce crosstalk, and improve overall bandwidth performance with minimal performance variance. The IMPACT High Density Backplane Connectors offered by TE are ideally suited for high speed, backplane applications such as switches, servers/blade servers, storage, and routers.
Features
- Differential pair density up to 80 pairs per linear inch
- Broad-edge-coupled, differential-pair system
- PCB routing complexity and costs are reduced by using 1.90mm x 1.35mm grid on backplane and daughter card
- Flexibility and advanced mechanical and electrical performance with two compliant-pin attach options
- In-line staggered, bifurcated contact beams in daughter card interfaces provides improved mating performance
Specifications
- 0.75A maximum current rating per pin
- 30VAC/DC maximum operating voltage
- 200 cycles durability
- -55°C to +85°C operating temperature range
Additional Resources
Videos
Paskelbta: 2011-03-03
| Atnaujinta: 2025-03-19