Ohmite 100W TO-247 Thick Film Power Resistor

Ohmite TEH100 Series 100W TO-247 Thick Film Power Resistors offer low ohmic value and non-inductive design for high frequency and pulse loading applications, especially power supplies. 100W power rated at 25ºC case temperature, the TEH100 series features non-inductive performance and low thermal resistance. The resistors were designed for non-induction, RoHS compliance, and the resistor package is totally insulated from the heat sink. The Ohmite TEH100 Series 100W TO-247 Thick Film Power Resistors have a molded housing for environmental protection and single screw mounting simplifies attachment to the heat sink.

Features

  • 100W power rating at 25ºC case temperature
  • Non-inductive performance
  • Low thermal resistance
  • RoHS compliant design
  • TO-247 package configuration
  • Single screw mounting simplifies attachment to the heat sink
  • A totally molded housing for environmental protection
  • Non-inductive design
  • Resistor package totally insulated from heat sink

Specifications

  • Electrical
    • Derating: linear, 100% at 25ºC to 0% at 175ºC
    • 0.05Ω to 1MΩ, other values on request resistance range
    • ±1%, ±2%, ±5%, ±10% resistance tol.
    • 350V max. working voltage
    • ±50ppm/ºC for >10Ω, referenced to 25ºC, ΔR taken at +105ºC; others on request temperature coefficient
    • 10GΩ insulation resistance
    • 1800VAC dielectric strength
  • Material
    • Resistor: thick film on alumina
    • Case: high temperature plastic
    • Lead material: tinned copper
    • Installation, max. Torque: 0.9Nm using an M3 screw and a compression washer

W Heatsinks for TO-247

The unique design (patent pending) of the Ohmite W Series heat sinks combines a tin-plated, solderable, integral spring clip with an extruded aluminum heat sink body for an all-in-one solution to the through-hole mounting of TO-220 or TO-247 packages. These self-aligning heat sinks feature solderable feet and an integrated clip with 13.2 (lbf) of force on the center of the device to enhance thermal performance.

Paskelbta: 2010-03-24 | Atnaujinta: 2022-03-11