Laird Technologies Thermal Design Solutions
Laird Technologies delivers thermal design solutions to help designers solve complex thermal challenges. These thermal interface material (TIM) options are engineered for use in automotive, telecom, data center, power conversion systems, and other markets. Products include thermal adhesive, thermal gap fillers, thermally conductive pads, thermal tape, phase-change materials (PCM), and metal interface materials. Laird TIM products help transport heat away from critical components, particularly when forced airflow is unavailable.
Why TIM is Necessary
TIM Options
• Thermal adhesive - a bond layer thicker than thermal paste
• Thermal gap fillers - curing thermal paste or non-adhesive thermal glue
• Thermally conductive pads - a TIM in a solid-state form factor, can also be soft
• Thermal tape - essentially a thermal pad with adhesive properties
• Phase-change materials (PCM) - changes phase only once to allow the material to fill up nooks and crevices
• Metal interface materials - soft metals that conform to the two surfaces of interest
Paskelbta: 2022-05-04
| Atnaujinta: 2025-06-17