ISSI 4GBit DDR3 SDRAM

ISSI 4GBit DDR3 SDRAM delivers high-speed SDRAM in compact BGA-78 and BGA-96 packages. ISSI 4GBit DDR3 SDRAM features 256Mx16 organization and supply voltage at either 1.45V or 1.3V with a maximum clock frequency of 666MHz or 800MHz. This SDRAM has 8 internal banks for concurrent operation and 8nBit pre-fetch architecture. ISSI 4GBit DDR3 SDRAM is ideal for telecom and networking, automotive, and industrial embedded computing.

Features

  • VDD and VDDQ = 1.5V ± 0.075V standard voltage
  • Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
  • Backward compatible to 1.5V
  • High speed data transfer rates with system frequency up to 1066MHz
  • 8 internal banks for concurrent operation
  • 8n-Bit pre-fetch architecture
  • Programmable CAS Latency
  • 0, CL-1, CL-2 programmable additive latency
  • Programmable CAS WRITE latency (CWL) based on tCK
  • 4 and 8 programmable burst length
  • Sequential or interleave programmable burst sequence
  • BL switch on the fly
  • Auto Self Refresh(ASR)
  • Self Refresh Temperature(SRT)
  • Refresh Interval:
    • 7.8µs (8192 cycles/64ms) Tc= -40°C to 85°C
    • 3.9µs (8192 cycles/32ms) Tc= 85°C to 105°C
    • 1.95µs (8192 cycles/16ms) Tc= 105°C to 115°C
    • 0.97µs (8192 cycles/8ms) Tc= 115°C to 125°C
  • Partial array self refresh
  • Asynchronous RESET pin
  • TDQS (Termination Data Strobe) supported (x8 only)
  • OCD (Off-Chip Driver Impedance Adjustment)
  • Dynamic ODT (On-Die Termination)
  • Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
  • Write leveling
  • Up to 200MHz in DLL off mode
  • Operating temperature:
    • Commercial (TC = 0°C to +95°C)
    • Industrial (TC = -40°C to +95°C)
    • Automotive, A1 (TC = -40°C to +95°C)
    • Automotive, A2 (TC = -40°C to +105°C)
    • Automotive, A25 (TC = -40°C to +115°C)
    • Automotive, A3 (TC = -40°C to +125°C)
  • 512Mx8, 256Mx16 configuration
  • Package:
    • 96-ball BGA (9.0mm x 13.0mm) for 256Mx16
    • 78-ball BGA (8.0mm x 10.5mm) for 512Mx8

Applications

  • Automotive
    • Infotainment
    • Telematics
    • Driver information systems
  • Industrial
    • Human machine interface
    • Embedded computing
  •  Telecom/Networking
    • Access nodes (PON OLT, DSLAM, CMTS, Wireless)
    • Aggregation nodes
    • Switches and routers
    • Packet optical transport
    • Network storage
Paskelbta: 2013-09-11 | Atnaujinta: 2024-03-05