Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel

Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel efficiently manages heat dissipation and accommodates mass production demands for high-temperature devices. The interface material is a red, pre-cured, one-part gel that requires no mixing or refrigeration and offers 10.0W/m-K thermal conductivity. Operating between -60°C to +200°C, the Liqui-Form TLF 10000 10W/m-K Thermal Gel's formulation ensures a balanced mix of high thermal conductivity, good-dispensing efficiency, and high-thermal reliability. This material is specially designed to provide an effective electronic component cooling capability for 5G base stations and remote antenna assemblies, requiring highly-reliable vertical gap stability. Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel comes in a 150cc cartridge and a 0.8-gallon pail.

Features

Red, silicone, one-part, pre-cured formulation requires no mixing and provides easy handling/processing and bondline thickness control
Excellent thermal cycling performance, 10.0W/m-K thermal conductivity for efficient, high-performance component cooling
Reliable vertical gap stability for gaps ranging from 0.5mm to 1.5mm based on 2,350hrs of testing at -40°C to +125°C
Provides supply chain simplicity as a single material can be used for various devices and differing volumes

Low thermal impedance
Dispensing speeds as fast as 22g/minute with excellent flow rate stability for high-volume manufacturing
Very low assembly stress reduces opportunities for component damage
Minimal resin bleed
Available sizes
- 150cc cartridge
- 0.8-gallon pail

Specifications

Viscosity
- 1492 low shear rate, 1.0s^-1, ASTM D2196
- 349 high shear rate, 100s^-1, ASTM D5099
22g/minute dispense rate
0.5% total mass loss, outgassing, ASTM E595
180-day shelf-life at 0 to +35°C and 50% RH