Amphenol FCI MEG-Array® Mezzanine Connector System
Amphenol FCI MEG-Array® Mezzanine Connector System provides the high density and high speed of a large array supported by the reliability and cost-effectiveness of a standard surface mount PCB assembly. MEG-Array optimizes high-speed signal integrity at speeds exceeding 10GB/s through flexible ground distribution. This system provides a 1.27mm x 1.27mm array of discrete circuit contacts and a variety of PCB mezzanine stack heights. MEG-Array applications include a variety of communications, data, and industrial devices.
Features
- High density, high speed, discrete contact, array connectors
- Flexible ground distribution optimizes high-speed signal integrity
- 10Gb/s differential pair performance with under 1% cross-talk
- 28Gb/s high-speed performance documented for 4mm and 6mm stack height
- Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
- 1.27mm x 1.27mm grid provides 71 contacts per cm2 density to save space
- Dual-point, long wipe contacts
- Wide range of sizes and PCB stack heights increase mechanical design flexibility
- 4mm to 14mm PCB stack heights
- 81 to 528 positions in eight size options
- BGA interconnect platform
- >22-year-old solder joint reliability per IPC-SM-785
- Telcordia GR-1217-CORE and NPS-25298-2 verified performance
Applications
- Data
- Servers
- Storage
- Industrial and instrumentation
- Industrial controls and equipment
- Analytical and diagnostic
- Medical
- Communications
- Transmission
- Access
- Switching
- Optics
- Networking
Specifications
- 0.45A current rating
- 2000VAC maximum dielectric withstanding voltage
- 1000mΩ minimum insulation resistance
- 50, 100, or 200-cycle durability
- 0.80mm nominal contact wipe
- Materials
- Liquid crystal polymer housing
- Copper alloy contacts
- Lead-free solder sphere
Videos
MEG-Array Connector Sizes
Additional Resources
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Paskelbta: 2017-03-01
| Atnaujinta: 2024-10-29