Wakefield Thermal ulTIMiFlux Thermal Gap Filling Pads
Wakefield Thermal ulTIMiFlux Thermal Gap Filling Pads are designed to fill large voids between a device and the heat sink. A variety of sizes, thicknesses, conductivities, and durometers are available to configure a custom thermal solution. These pads from Wakefield Thermal are halogen free and RoHS compliant.
Features
- Excellent thermal conductivity
- Natural tackiness with no need for adhesive
- Excellent compression characteristics
- Good wet-out and superb flexibility
- Excellent converting properties
- Halogen free and RoHS compliant
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