Minitek® Pwr 3.0 Higher Current Connectors

Amphenol FCI Minitek® Pwr 3.0 Higher Current Connectors (HCC) are designed for power-dense applications with current ratings up to 12.5A per contact. This connector series is available in a dual-row configuration with 2 to 24 circuits and is designed for Wire-to-Wire, Wire-to-Board, and Wire-to-Panel applications. Crimp, snap-in header, and receptacle contacts are used to terminate 20AWG to 16AWG wires.

Types of Connectors

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Results: 83
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 12 Positions, Black Color, LCP, GW Compatible, Tray packing
130On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing
110On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing
100Expected 8/21/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing
90On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing
80On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing
80On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 04 Positions, Black Color, LCP, GW Compatible, Tray packing
280Expected 8/7/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 08 Positions, Black Color, LCP, GW Compatible, Tray packing
190Expected 8/7/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 10 Positions, Black Color, LCP, GW Compatible, Tray packing
170Expected 8/7/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 12 Positions, Black Color, LCP, GW Compatible, Tray packing
150Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing
130Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing
120Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing
110Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing
100Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing
90Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 24 Positions, Black Color, LCP, GW Compatible, Tray packing
80Expected 8/10/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 14Pos Non-Stocked Lead-Time 13 Weeks
Min.: 6 000
Mult.: 6 000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 18Pos Non-Stocked Lead-Time 13 Weeks
Min.: 6 000
Mult.: 6 000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 20Pos Non-Stocked Lead-Time 13 Weeks
Min.: 6 000
Mult.: 6 000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 22Pos Non-Stocked Lead-Time 13 Weeks
Min.: 6 000
Mult.: 6 000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 24Pos Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 2Pos G/F Non-Stocked Lead-Time 13 Weeks
Min.: 9 842
Mult.: 9 842
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 2Pos Tin Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 4Pos G/F Non-Stocked Lead-Time 13 Weeks
Min.: 6 188
Mult.: 6 188
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 6Pos G/F Non-Stocked Lead-Time 13 Weeks
Min.: 4 522
Mult.: 4 522