Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Package/Case
Material
Thermal Conductivity
Breakdown Voltage
Color
Minimum Operating Temperature
Maximum Operating Temperature
Length
Width
Thickness
Tensile Strength
Flammability Rating
Series
Packaging
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 6
Mult.: 1
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM
Datasheet
Non-Stocked Lead-Time 19 Weeks
Min.: 438
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2233096
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500
Bergquist Company Thermal Interface Products
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company Thermal Interface Products Liquid Epoxy Adhesive, 2-Part, 200CC Dual Cartridge, Liqui-Bond TLBEA1800/EA1805
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Thermal Conductive Gel Paste Epoxy 1.8 W/m-K Gray, Yellow - 40 C + 125 C 450 psi UL 94 V-0 EA 1805 / TLB EA1800
Bergquist Company Thermal Interface Products Liquid Silicon Adhesive, 1-Part, 50CC Dual Cartridge, LIQUI-BOND TLBSA3500
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermally Conductive Adhesives Silicone Elastomer Brown - 60 C + 200 C UL 94 V-0 SA 3505 / TLB SA3500
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-8G FLEX
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 833 334
Mult.: 1

TLF 6000HG
Bergquist Company TLF600HG00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 3
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 2 871
Mult.: 1

TLF 6000HG
Bergquist Company 2763096
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 6.0 W/m-K, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2746333
Bergquist Company Thermal Interface Products GAP PAD, Conductive, Reinforced, Soft S-Class Gap Fill, 3.0 W/m-K
Datasheet
Non-Stocked Lead-Time 15 Weeks
Min.: 9
Mult.: 1

3000ULM / TGP 3000ULM