EasyPACK™ C Series CoolSiC MOSFETs Modules

Infineon Technologies EasyPACK™ C Series CoolSiC MOSFETs Modules combine second-generation CoolSiC trench MOSFETs with the low inductance Easy C series platform and .XT interconnect technology. These Infineon modules deliver ultra-low switching losses, tighter parasitic control, and enhanced robustness during power cycling. Rugged PressFIT pins, integrated NTC sensing, integrated mounting clamps, and high CTI insulation streamline assembly and support demanding mission profiles. Available in four-pack (F4) and 3-level (F3) topologies, the series is offered in 8mΩ and 13mΩ resistance classes to help users raise switching frequency, shrink magnetics, and boost power density while maintaining EMI performance and thermal margin.

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Qty. RoHS ECAD modelis Technologijos
Montavimo stilius
Vds - nutekėjimo-šaltinio pramušimo įtampa
svar. – nuolatinio išleidimo srovė
RDS On - Drain-Source Varža
Vgs - užtūros-šaltinio įtampa
Vgs th - užtūros-šaltinio slenkstinė įtampa
Minimali darbinė temperatūra
Didžiausia darbinė temperatūra
Pd - skaidos galia
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Pakavimas
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Duomenų Lapas
33Prieinamumas
Min.: 1
Daugkart.: 1

SiC Press Fit 1.2 kV 95 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Duomenų Lapas
16Prieinamumas
Min.: 1
Daugkart.: 1

SiC Press Fit 1.2 kV 95 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET moduliai EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
Duomenų Lapas
45Prieinamumas
Min.: 1
Daugkart.: 1

SiC Press Fit 1.2 kV 60 A 25.2 mOhms - 10 V, + 25 C 4.35 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET moduliai EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Duomenų Lapas
30Prieinamumas
Min.: 1
Daugkart.: 1

SiC Press Fit 1.2 kV 60 A 25.2 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Duomenų Lapas
23Prieinamumas
Min.: 1
Daugkart.: 1

SiC Press Fit 1.2 kV 95 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Duomenų Lapas
33Prieinamumas
Min.: 1
Daugkart.: 1

SiC Press Fit 1.2 kV 100 A 16.8 mOhms - 10 V, + 25 V 4.3 V - 40 C + 175 C 20 mW EasyPACK C series Tray