FC20N-Q73

Name: Quectel FC20N-Q73
Brand: Quectel
SKU: 277-FC20N-Q73
Price: 7.91 EUR
Availability: Discontinued

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See Product Specifications

Mouser No:

277-FC20N-Q73

Mfr. No:

FC20N-Q73

Mfr.:

Quectel

Description:

Multiprotocol Modules Wifi Modules

Lifecycle:

NRND:

Not recommended for new designs.

Datasheet:

FC20N-Q73 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Quectel FC20N-Q73

Shipping Alert:

Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Quectel
Product Category:	Multiprotocol Modules
Delivery Restrictions:	Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.
Frequency:	2.4 GHz
Output Power:	17.5 dBm
Interface Type:	SDIO, UART
Supply Voltage - Min:	3.3 V
Supply Voltage - Max:	3.3 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	16.6 mm x 13 mm x 2.1 mm
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth 5.0
Protocol - WiFi - 802.11:	802.11 a/b/g/n/ac
Packaging:	Reel
Brand:	Quectel
Data Rate:	150 Mb/s
Modulation Technique:	16QAM, 64 QAM, BPSK, CCK, QPSK
Moisture Sensitive:	Yes
Operating Supply Voltage:	3.3 V
Product Type:	Multiprotocol Modules
Security:	WEP/TKIP/AES/WPA-PSK/WPA2-PSK
Factory Pack Quantity:	250
Subcategory:	Wireless & RF Modules
Tradename:	Wireless communication module
Unit Weight:	800 mg

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Datasheet

FC20N-Q73 Datasheet (PDF)

PCN

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

FC20 & FC30 Wi-Fi® Modules

Quectel Wireless Solutions FC20 and FC30 Wi-Fi® Modules offer high performance in an ultra-compact package, making them ideal for size-sensitive applications. The ultra-compact package provides reliable connectivity and can be easily embedded in size-constrained applications. The Wi-Fi Modules' advanced package allows for large-scale automated manufacturing and high cost-effectiveness and efficiency.