QS93 QFN-Style Solder-Down Computer-on-Module

Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module (COM) features an NXP i.MX 93 processor that includes a 1.5GHz Dual ARM® Cortex®-A55, a 250MHz ARM Cortex-M33, and an ARM® Ethos® U-65 microNPU with NXP’s EdgeLock® secure enclave. The 100-pin QFN-type lead-styled module measures 27mm² x 2.6mm in height and provides single-sided assembly in an industrial -40°C to +85°C temperature range. The Ka-Ro Electronics QS93 Computer-on-Module (COM) uses a large ground pad on the bottom side for a good return path for all signals.