Soft Termination

TDK Soft Termination is a type of MLCC in which a conductive resin layer is provided between the Cu and Ni plating layer. In the terminal electrode of a regular MLCC, the Cu underlayer is plated with Ni and Sn. The resin layer absorbs stress accompanying expansion or shrinkage of the solder joints due to thermal shock or flex stress on the board and prevents cracking of the capacitor element. TDK's soft termination capacitors not only improve vibration resistance and withstand tumbling shock, but even more so prevent bending and thermal cycling.