3.3 V Multiprotocol Modules

Rezultatai: 194
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Qty. RoHS ECAD modelis Serija
Dažnis
Išvesties Galia
Interface Type
Maitinimo Įtampa - Min.
Maksimali Maitinimo Įtampa
Minimali darbinė temperatūra
Didžiausia darbinė temperatūra
Antenos jungties tipas
Matmenys
Protokolas – „Bluetooth“, BLE – 802.15.1
Protokolas – korinis, NBIoT, LTE
Protokolas – GPS, GLONASS
Protokolas – „WiFi“ – 802.11
Protokolas – ANT, „Thread“, „Zigbee“ – 802.15.4
Kvalifikacija
Pakavimas
Ezurio Multiprotocol Modules BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Trace pin (Cut Tape)
Duomenų Lapas
128Prieinamumas
Min.: 1
Daugkart.: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Multiprotocol Modules Module, Sona IF573, MIMO, MHF4, Cut Tape
Duomenų Lapas
246Prieinamumas
Min.: 1
Daugkart.: 1

Sona IF573 2.4 GHz, 5 GHz, 6 GHz UART 3.13 V 3.47 V - 40 C + 85 C Bluetooth Core 6.0, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Cut Tape
Microchip Technology Multiprotocol Modules ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Duomenų Lapas
2 241Prieinamumas
Min.: 1
Daugkart.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Advantech Multiprotocol Modules 802.11ax+BT5.3, NXP 88W9098, PCIe-UART,
Duomenų Lapas
215Prieinamumas
Min.: 1
Daugkart.: 1
AIW-165 2.4 GHz, 5 GHz UART 3.3 V 3.3 V - 40 C + 85 C Without Antenna 28 mm x 30 mm x 3.95 mm Bluetooth 5.3
Ezurio Multiprotocol Modules BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Integrated antenna (Cut Tape)
Duomenų Lapas
246Prieinamumas
Min.: 1
Daugkart.: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Signetik Multiprotocol Modules Nordic Cellular CAT M-1 GNSS/GPS Intelligent IoT Low Profile Connector
Duomenų Lapas

SigCell 700 MHz to 2.2 GHz GPIO, I2C, I2S, PWM, SPI, UART 2.5 V 5.5 V - 40 C + 85 C u.FL 32.8 mm x 24.5 mm x 4.5 mm Cellular, NBIoT, LTE GNSS, GPS

Ezurio Multiprotocol Modules 2.4GHz + 5GHz WiFi AC module + BT5.0
Duomenų Lapas
2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 70 C u.FL 13 mm x 18 mm Bluetooth 4.1 802.11 a/b/g/n/ac
AAEON UP Multiprotocol Modules Quectel 4G LTE CAT4 Global module EG-25G Mini PCIe with RF Cable 150mm and LTE Full band & GPS Antenna
Duomenų Lapas
47Prieinamumas
Min.: 1
Daugkart.: 1

33 dBm PCIe, UART, USB 3.3 V 3.3 V - 40 C + 80 C u.FL 50 mm x 30 mm x 4.9 mm LTE GNSS Bulk
Ezurio Multiprotocol Modules Sterling LWB+, Chip Antenna, CutTape
Duomenų Lapas
1 154Prieinamumas
Min.: 1
Daugkart.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Ezurio Multiprotocol Modules Module, Sterling LWB5+, Chip Antenna
Duomenų Lapas
640Prieinamumas
Min.: 1
Daugkart.: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Advantech Multiprotocol Modules AX210 6E 802.11ax+BT5.2 vpo module+anten
Duomenų Lapas
290Prieinamumas
Min.: 1
Daugkart.: 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Duomenų Lapas
7Prieinamumas
Min.: 1
Daugkart.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Pulse Electronics Multiprotocol Modules USB 802.11 b/g/n BT module
746Prieinamumas
Min.: 1
Daugkart.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology Multiprotocol Modules [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Duomenų Lapas
15Prieinamumas
Min.: 1
Daugkart.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Ezurio Multiprotocol Modules Sterling LWB+, MHF4, Cut Tape
Duomenų Lapas
38Prieinamumas
200Tikėtina 2026-11-24
Min.: 1
Daugkart.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Espressif Systems Multiprotocol Modules SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Duomenų Lapas
849Prieinamumas
3 250Tikėtina 2026-07-14
Min.: 1
Daugkart.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems Multiprotocol Modules SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Duomenų Lapas
3 077Prieinamumas
Min.: 1
Daugkart.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Silex Technology Multiprotocol Modules 2x2 Dual Band 802.11 ac WLAN+BT PCIe
Duomenų Lapas
87Prieinamumas
101Tikėtina 2026-08-03
Min.: 1
Daugkart.: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Duomenų Lapas
75Prieinamumas
678Tikėtina 2026-12-31
Min.: 1
Daugkart.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
STMicroelectronics Multiprotocol Modules NB-IoT module with extra ADC. Supported LTE FDD frequency bands: B1, B3, B5, B8, B20, B2
Duomenų Lapas
453Prieinamumas
„MouseReel“ galima
Min.: 1
Daugkart.: 1
: 800

ST67W 2.412 GHz to 2.484 GHz 10 dBm SPI, UART 2.97 V 3.63 V - 40 C + 85 C RF Bluetooth WiFi Reel, Cut Tape, MouseReel

Murata Electronics Multiprotocol Modules Type 1LD Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.2
845Prieinamumas
Min.: 1
Daugkart.: 1
: 1 000

1LD 2.4 GHz 17 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C External 8.9 mm x 7.8 mm x 1.2 mm Bluetooth 4.2 802.11 a/b/g/n/ac AWS Reel, Cut Tape
CEL Multiprotocol Modules WiFi+BLE, USB, Ant.
Duomenų Lapas
105Prieinamumas
Min.: 1
Daugkart.: 1

CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C Chip 24 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Sierra Wireless Multiprotocol Modules 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35
Duomenų Lapas
131Prieinamumas
200Tikėtina 2026-07-22
Min.: 1
Daugkart.: 1

USB 3.135 V 4.4 V Tray
Silex Technology Multiprotocol Modules [Sample SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. Ideal for low quantity
Duomenų Lapas
18Prieinamumas
110Tikėtina 2027-02-12
Min.: 1
Daugkart.: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, voice + data application, North America, mPCIe form factor
Duomenų Lapas
79Prieinamumas
Min.: 1
Daugkart.: 1

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray