3M IC & Component Sockets

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Qty. RoHS ECAD modelis Gaminys
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3M Electronic Solutions Division IC & Component Sockets LASER DIODE SOCKET 3 Contact Qty.
Duomenų Lapas
71Prieinamumas
Min.: 1
Daugkart.: 1
Test & Burn-In Sockets 3 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets LASER DIODE SOCKET 4 Contact Qty.
Duomenų Lapas
14Prieinamumas
Min.: 1
Daugkart.: 1
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Test & Burn-In Sockets 4 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,48P EVEN RW,W/O THRML PN
Duomenų Lapas
16Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 48 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,64P EVEN ROW,W/THRML PI
Duomenų Lapas
41Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 64 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 40P DUAL WIPE DIPSKT
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5 804Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 40 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Tube
3M Electronic Solutions Division IC & Component Sockets 40P DUAL WIPE DIPSKT
Duomenų Lapas
2 467Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 40 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Tube
3M Electronic Solutions Division IC & Component Sockets POWER IN-LINE SOCKET 3contact, 1 piece
Duomenų Lapas
100Prieinamumas
280Pagal užsakymą
Min.: 1
Daugkart.: 1

Transistor Sockets 3 Position 2 Row Discrete Power In-Line 5.94 mm Solder Gold 8.23 mm - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets .1" INLINE ZIP STRIP Socket 10 Contct Qt
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57Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 10 Position 1 Row SIP Socket 2.54 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,24P EVEN ROW,W/THRML PI
Duomenų Lapas
21Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 24 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 0.100" DIP SOCKET 48 Contact Qty.
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45Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 48 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 8P DUAL WIPE DIPSKT
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5 649Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 8P DUAL WIPE DIPSKT
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23 470Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 14P DUAL WIPE DIPSKT
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11 099Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 14 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 16P DUAL WIPE DIPSKT
Duomenų Lapas
5 123Prieinamumas
10 000Tikėtina 2026-09-07
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 16 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 18P DUAL WIPE DIPSKT
Duomenų Lapas
8 744Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 24P DUAL WIPE DIPSKT
Duomenų Lapas
4 197Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 28P DUAL WIPE DIPSKT
Duomenų Lapas
4 670Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 28 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 32P DUAL WIPE DIPSKT
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2 393Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 32 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .4MM,56P EVEN ROW,W/THRML PI
Duomenų Lapas
6Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 8 Leads
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48Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 8 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 14 Contact Qty.
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17Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 14 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads
Duomenų Lapas
1Prieinamumas
20Tikėtina 2026-09-03
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 14 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
Duomenų Lapas
19Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 16 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,16P EVEN ROW,W/THRML PI
Duomenų Lapas
6Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 16 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
Duomenų Lapas
6Prieinamumas
30Tikėtina 2026-08-10
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each