3M Electronic Solutions Division IC & Component Sockets

Rezultatai: 237
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3M Electronic Solutions Division IC & Component Sockets 20P PLCC SOCKET SMT W/O LOC POSTS
Duomenų Lapas
3 738Prieinamumas
Min.: 1
Daugkart.: 1

PLCC Sockets 20 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 5.08 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets 28P PLCC SOCKET THRU-HOLE
Duomenų Lapas
1 438Prieinamumas
Min.: 1
Daugkart.: 1

PLCC Sockets 28 Position 4 Row Chip Carrier 1.27 mm Solder Tail Tin 7.62 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .4MM,56P EVEN ROW,W/THRML PI
Duomenų Lapas
19Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 44P PLCC SOCKET THRU-HOLE
Duomenų Lapas
5 751Prieinamumas
Min.: 1
Daugkart.: 1

PLCC Sockets 44 Position 4 Row Chip Carrier 1.27 mm Solder Tail Tin 12.7 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets 18P DUAL WIPE DIPSKT
Duomenų Lapas
7 632Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 5 CON STR BRDMNT SKT
Duomenų Lapas
1 339Prieinamumas
Min.: 1
Daugkart.: 1

Headers 5 Position 1 Row Socket 2.54 mm (0.1 in) Solder Pin Tin - 40 C + 105 C 929 Each
3M Electronic Solutions Division IC & Component Sockets 24P DUAL WIPE DIPSKT
Duomenų Lapas
3 647Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 18 Leads
Duomenų Lapas
52Prieinamumas
Min.: 1
Daugkart.: 1

18 Position Solder Tail Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets 0.100" DIP SOCKET 16 Contact Qty.
Duomenų Lapas
132Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 16 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 20P DUAL WIPE DIPSKT
Duomenų Lapas
8 131Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 20 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets SOCKET 28POS .3" IC OPEN FRAME
Duomenų Lapas
4 999Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 28 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 18P DUAL WIPE DIPSKT
Duomenų Lapas
6 505Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
Duomenų Lapas
12Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 32 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 68P PLCC SOCKET SMT W/O LOC POSTS
Duomenų Lapas
1 241Prieinamumas
Min.: 1
Daugkart.: 1

PLCC Sockets 68 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 20.32 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets 84P PLCC SOCKET SMT W/LOCATION POSTS
Duomenų Lapas
998Prieinamumas
Min.: 1
Daugkart.: 1

PLCC Sockets 84 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 25.4 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets 32P PLCC SOCKET SMT W/LOCATION POSTS
Duomenų Lapas
1 389Prieinamumas
Min.: 1
Daugkart.: 1

PLCC Sockets 32 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 10.16 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
Duomenų Lapas
39Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets 24P DUAL WIPE DIPSKT
Duomenų Lapas
2 936Prieinamumas
Min.: 1
Daugkart.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
Duomenų Lapas
7Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 64 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 20.32 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
Duomenų Lapas
10Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
Duomenų Lapas
11Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 42 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 15.24 mm - 55 C + 125 C
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
Duomenų Lapas
7Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 10.16 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
Duomenų Lapas
13Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 40 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 25.4 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
Duomenų Lapas
2Prieinamumas
Min.: 1
Daugkart.: 1

Zero Insertion Force (ZIF) Sockets 42 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,40P EVEN RW,W/O THRML PN
Duomenų Lapas
16Prieinamumas
Min.: 1
Daugkart.: 1

Test & Burn-In Sockets 40 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each