BALF-SPI2-02D3

STMicroelectronics
511-BALF-SPI2-02D3
BALF-SPI2-02D3

Gam.:

Aprašymas:
Signal Kondicionavimas 50 ohms nominal input / conjugate match balun to S2-LP, 433 - 470 MHz with int
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Duomenų Lapas:
ECAD modelis:
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Prieinamumas: 7 854

Turime sandėlyje:
7 854 Galime išsiųsti iš karto
Gamintojo numatytas pristatymo laikas
13 Savaičių Apytikriai apskaičiuotas gamybos laikas gamykloje, jei dalių kiekis didesnis nei nurodyta.
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
0,353 € 0,35 €
0,323 € 3,23 €
0,303 € 7,58 €
0,293 € 29,30 €
0,282 € 70,50 €
0,273 € 136,50 €
0,26 € 260,00 €
Visa Ritė (Užsakoma po 5000)
0,221 € 1 105,00 €

Produkto Požymis Atributo vertė Pasirinkite Požymį
STMicroelectronics
Gaminio kategorija: Signal Kondicionavimas
RoHS:  
Signal Conditioning
Baluns
433 MHz
50 Ohms
SMD/SMT
Flip-Chip-6
- 40 C
+ 105 C
BALF-SPI2-02D3
Reel
Cut Tape
Prekės Ženklas: STMicroelectronics
Insertion Nuostoliai: 1.95 dB
Montavimas: Board Mount
Gamyklinės pakuotės kiekis: 5000
Subkategorija: Filters
Tipas: Ultra-Miniature
Vieneto Svoris: 23 mg
Rasta produktų:
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Pasirinkti atributai: 0

Duomenų Lapas

PCN

Reglamentavimo kodai
CNHTS:
8504319000
USHTS:
8542390090
ECCN:
EAR99
Klasifikacija pagal kilmę
Kilmės šalis:
Prancūzija
Šalis, kurioje pagaminta:
Ne
Distribucijos šalis:
Ne
Šalis gali keistis siuntimo metu.

Wireless Connectivity Solutions

STMicroelectronics Wireless Connectivity Solutions are a portfolio of wireless technology products that feature specific communication ranges, power efficiencies, latencies, bandwidths, and networking topologies. These are important parameters defined by the many standard communication protocols available. With the growing importance of wireless sensor networks and Internet of Things-related devices, there is virtually no electronic system that doesn't require wireless connectivity. Typical uses are consumer to industrial applications like wearable devices, smart-buildings, home-automation, asset-tracking solutions, or medical devices. ST’s portfolio offers an extensive variety of RF solutions covering most of the key protocols and standards and proprietary radio solutions. This includes ultra-low-power RF transceivers, network processors ICs, and a comprehensive family of Wireless System-on-Chips, including pre-certified wireless modules to simplify quick adoption of those technologies. The ST wireless portfolio covers the widest range of connectivity technologies including sub-1GHz long-range networking devices (enabling LoRaWAN®, Sigfox, and Wireless M-Bus connectivity), 60GHz short-range millimeter-wave RF, Bluetooth® LE, 802-15-4, OpenThread, LTE Cat 1, and Narrowband IoT. To speed time to market, reference designs and RF modules are available as a complete development ecosystem and framework with software packages, tools, protocol stacks, example applications, evaluation boards, and quick-start tutorials. This represents an all-in-one solution for a smarter and more connected world with the most sustainable wireless technologies.

BALF-SPI2-02D3 Ultra-miniature Balun

STMicroelectronics BALF-SPI2-02D3 Ultra-miniature Balun integrates matching network and harmonics filter. This balun with matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-02D3 uses IPD technology on a non-conductive glass substrate, which optimizes the RF performance. The BALF-SPI2-02D3 balun features 50Ω nominal input, low insertion loss, low amplitude imbalance, low-phase imbalance, high-RF performance, RF BOM, and area reduction. The STMicroelectronics BALF-SPI2-02D3 Ultra-miniature Balun is ideal for 433MHz impedance-matched balun filters and is optimized for ST S2-LP sub-GHz RFIC.

Balun Transformers

STMicroelectronics Balun Transformers use ST's process of integrating high-quality RF passive components on a single glass substrate. In addition to balanced/unbalanced conversion, these baluns can incorporate a matching network in a footprint smaller than 1mm2 for the complete function. The baluns are designed using STMicroelectronics Integrated Passive Device (IPD) technology on a non-conductive glass substrate to optimize RF performance. These baluns include companion chips to ST's transceivers, help significantly reduce RF complexity, and provide an optimized link budget. Balun transformers integrate three functions: impedance matching, 50Ω nominal impedance, and harmonic filter.

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