nRF9161 System-in-Package (SiP)

Nordic Semiconductor nRF9161 System-in-Package (SiP) offers low-power LTE technology, advanced processing capabilities, and robust security functions. These features deliver high performance and versatility in cellular IoT and DECT NR+ applications. The nRF9161 SiP includes a programmable Arm® Cortex®-M33 system-on-chip (SoC), an RF front-end, a comprehensive LTE modem with GNSS and DECT NR+ capability, a power management system (PMIC), and the necessary passives and crystals. Nordic Semiconductor nRF9161 SIP is housed within a compact 10mm x 16mm design and is certified for global operation.

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Qty. RoHS ECAD modelis Dažnis
Išvesties Galia
Interface Type
Maitinimo Įtampa - Min.
Maksimali Maitinimo Įtampa
Minimali darbinė temperatūra
Didžiausia darbinė temperatūra
Matmenys
Protokolas – korinis, NBIoT, LTE
Protokolas – GPS, GLONASS
Pakavimas
Nordic Semiconductor Multiprotocol Modules Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
Duomenų Lapas
4 515Prieinamumas
Min.: 1
Daugkart.: 1
Reel: 2 500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Nordic Semiconductor Multiprotocol Modules Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
Duomenų Lapas
400Prieinamumas
Min.: 1
Daugkart.: 1
Reel: 100

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape