EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.

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Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
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24Tikėtina 2026-08-03
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
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15Prieinamumas
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MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
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18Tikėtina 2026-08-03
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Daugkart.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
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MOSFET Modules SiC Press Fit
Infineon Technologies Diskrečiųjų Puslaidininkių Moduliai EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC
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Discrete Semiconductor Modules SiC Press Fit
Infineon Technologies MOSFET moduliai EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
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15Prieinamumas
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MOSFET Modules SiC Press Fit