9703-4X10

3M Electronic Specialty
517-9703-4X10
9703-4X10

Gam.:

Aprašymas:
Lipniosios juostos Electrically Conductive Adhesive Transfer Tape 4 in x 10yd Roll

Prieinamumas: 17

Turime sandėlyje:
17
Galime išsiųsti iš karto
Pagal užsakymą:
33
Tikėtina 2026-03-09
Gamintojo numatytas pristatymo laikas
8
Savaičių Apytikriai apskaičiuotas gamybos laikas gamykloje, jei dalių kiekis didesnis nei nurodyta.
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:
Šis Produktas Siunčiamas NEMOKAMAI

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
234,66 € 234,66 €
206,50 € 2 478,00 €
197,40 € 5 329,80 €
192,30 € 9 807,30 €
102 Pasiūlymas

Produkto Požymis Atributo vertė Pasirinkite Požymį
3M
Gaminio kategorija: Lipniosios juostos
RoHS:  
Tapes
Conductive
Electrically Conductive Adhesive Transfer Tape
Acrylic
4 in
101.6 mm
10 yd
9.14 m
Prekės Ženklas: 3M Electronic Specialty
Gaminio tipas: Adhesive Tapes
Serija: 9703
Gamyklinės pakuotės kiekis: 3
Subkategorija: Supplies
Dalies Nr., kitokios klasifikacijos numeriai: 7100306861
Vieneto Svoris: 431 g
Rasta produktų:
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Pasirinkti atributai: 0

CNHTS:
3919109900
USHTS:
4811412100
JPHTS:
481141000
KRHTS:
4811410000
MXHTS:
4811410100
BRHTS:
48114190
ECCN:
EAR99

9703 Series Electrically Conductive Adhesive Tapes

3M™ 9703 Series 1510-001G-011 Electrically Conductive Adhesive Transfer Tapes feature adhesive-coated liners for a more conformable and flexible double-sided tape. These transfer tapes offer Z-axis-based conductivity in a variety of conductive adhesives, carriers, and fillers to provide enhanced EMI performance. The adhesive transfer tapes electrically connect and mechanically bond medium-pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB), or LCD screens. The electrically conductive adhesive transfer tapes are available in multiple thicknesses and provide EMI/RFI shielding and grounding across various frequencies.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.