GPVOUS-0.060-00-0816

Bergquist Company
951-GPVOUS-060-00
GPVOUS-0.060-00-0816

Gam.:

Aprašymas:
Terminiai Interface Produktai GAP PAD, 8" x 16" Sheet, 0.060" Thickness TGP1000VOUS/VO Ultra Soft, IDH 2191191

ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas: 385

Turime sandėlyje:
385 Galime išsiųsti iš karto
Gamintojo numatytas pristatymo laikas
4 Savaičių Apytikriai apskaičiuotas gamybos laikas gamykloje, jei dalių kiekis didesnis nei nurodyta.
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
26,64 € 26,64 €
24,39 € 243,90 €
22,87 € 571,75 €
21,65 € 1 082,50 €
20,86 € 2 086,00 €
19,87 € 4 967,50 €

Produkto Požymis Atributo vertė Pasirinkite Požymį
Bergquist Company
Gaminio kategorija: Terminiai Interface Produktai
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone Elastomer
1 W/m-K
6 kVAC
Pink
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.524 mm
8 psi
UL 94 V-0
VO Ultra Soft / TGP 1000VOUS
Prekės Ženklas: Bergquist Company
Skirta: Telecommunications, Computers and Peripherals, Power Conversion, Semiconductors
Gaminio tipas: Thermal Interface Products
Dydis: 8 in x 16 in
Gamyklinės pakuotės kiekis: 1
Subkategorija: Thermal Management
Prekinis pavadinimas: GAP PAD
Dalies Nr., kitokios klasifikacijos numeriai: L8INW16INH0.06 2191191
Vieneto Svoris: 225,788 g
Rasta produktų:
Norėdami rodyti panašius produktus, pažymėkite bent vieną langelį
Pasirinkite bent vieną žymimąjį langelį, kad būtų rodomi panašūs šios kategorijos produktai.
Pasirinkti atributai: 0

TARIC:
8541900000
CNHTS:
3824999999
CAHTS:
8541900000
USHTS:
3919905060
JPHTS:
8542900006
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

TGP 1000VOUS Ultra Conformable GAP PAD®

Bergquist TGP 1000VOUS Ultra Conformable GAP PAD® filling material provides ultra-conformable gel-like material with thermal conductivity of 1.0W/m-K. This filling material is ultra-soft and offers excellent low-stress vibration dampening and shock absorbency for applications requiring a minimum amount of pressure on components. Bergquist GAP PAD TGP 1000VOUS Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.