5591-25

3M Electronic Specialty
517-5591-25
5591-25

Gam.:

Aprašymas:
Terminiai Interface Produktai WX300901310 3M(TM) THERMALLY COND INTERFACE PAD 5591, 210MM X 300MM 2.5MM

ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas: 106

Turime sandėlyje:
106 Galime išsiųsti iš karto
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
28,98 € 28,98 €
27,01 € 270,10 €
25,34 € 506,80 €
24,79 € 1 239,50 €
23,89 € 2 389,00 €
22,66 € 4 532,00 €

Produkto Požymis Atributo vertė Pasirinkite Požymį
3M
Gaminio kategorija: Terminiai Interface Produktai
Gap Fillers / Gap Pads / Sheets
Thermally Conductive Tape
Non-standard
Silicone Elastomer
1 W/m-K
White
- 50 C
+ 125 C
210 mm
300 mm
2.5 mm
UL 94 V-0
5591
Prekės Ženklas: 3M Electronic Specialty
Gaminio tipas: Thermal Interface Products
Gamyklinės pakuotės kiekis: 10
Subkategorija: Thermal Management
Dalies Nr., kitokios klasifikacijos numeriai: 5591 08806080063735 7010321481
Vieneto Svoris: 284,634 g
Rasta produktų:
Norėdami rodyti panašius produktus, pažymėkite bent vieną langelį
Pasirinkite bent vieną žymimąjį langelį, kad būtų rodomi panašūs šios kategorijos produktai.
Pasirinkti atributai: 0

CNHTS:
3824999999
USHTS:
3506911000
ECCN:
EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.