ADF6-50-07.5-L-4-0-A-TR

Samtec
200-ADF65007.5L40ATR
ADF6-50-07.5-L-4-0-A-TR

Gam.:

Aprašymas:
Plokščių ir tarpinės jungtys 0.635 mm AcceleRate HD High-Density 4-Row Socket

Eksploatacijos Laikotarpis:
Naujas Produktas:
Naujiena iš šio gamintojo.
ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas: 90

Turime sandėlyje:
90 Galime išsiųsti iš karto
Gamintojo numatytas pristatymo laikas
1 Savaitė Apytikriai apskaičiuotas gamybos laikas gamykloje, jei dalių kiekis didesnis nei nurodyta.
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
21,65 € 21,65 €
20,49 € 204,90 €
19,72 € 493,00 €
19,24 € 962,00 €
15,80 € 1 580,00 €
14,66 € 3 665,00 €
Visa Ritė (Užsakoma po 400)
14,66 € 5 864,00 €

Produkto Požymis Atributo vertė Pasirinkite Požymį
Samtec
Gaminio kategorija: Plokščių ir tarpinės jungtys
ADF6
Reel
Cut Tape
Prekės Ženklas: Samtec
Gaminio tipas: Board to Board & Mezzanine Connectors
Gamyklinės pakuotės kiekis: 400
Subkategorija: Board to Board & Mezzanine Connectors
Prekinis pavadinimas: AcceleRate HD
Rasta produktų:
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Pasirinkti atributai: 0

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USHTS:
8536694040
ECCN:
EAR99

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Ultra Micro Interconnects

Samtec Ultra Micro Interconnects offer a stack height as low as 2.31mm and pitches of 0.4mm, 0.5mm, 0.635mm, and 0.8mm. One to four rows are available, and termination styles include solder, solder balls, and solder pin. Samtec Ultra Micro Interconnects are available in several mounting angles, including horizontal, right, straight, and vertical. The product lineup features connectors, headers, receptacles, sockets, and hermaphroditic connectors.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

AcceleRate® HD Ultra-Dense Mezzanine Strips

Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips feature a low-profile 5mm stack height, slim 5mm width, and a 0.635mm pitch. These micro interconnects are super dense with up to 400 total inputs/outputs (I/Os). The four-row design allows 10 to 100 positions per row. Samtec AcceleRate HD header and socket connectors are PCIe® 6.0/CXL® 3.2 capable, support 64Gbps PAM4 (32Gbps NRZ) applications, and feature an Edge Rate® contact system that is optimized for signal integrity performance. The open-pin-field design offers grounding and routing flexibility.