1714505114

Molex
538-1714505114
1714505114

Gam.:

Aprašymas:
Plokščių ir tarpinės jungtys SpeedStack Vertical Receptacle, 0.80mm Pitch, 4.10mm Height, 82 Circuits, UL94V-0, Black

ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas

Turime sandėlyje:
Ne Sandėlyje Esantys
Gamintojo numatytas pristatymo laikas
Min. 1800   Užsakoma po 1800
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:
Šis Produktas Siunčiamas NEMOKAMAI

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
10,45 € 18 810,00 €

Produkto Požymis Atributo vertė Pasirinkite Požymį
Molex
Gaminio kategorija: Plokščių ir tarpinės jungtys
171450
Prekės Ženklas: Molex
Gaminio tipas: Board to Board & Mezzanine Connectors
Gamyklinės pakuotės kiekis: 1800
Subkategorija: Board to Board & Mezzanine Connectors
Prekinis pavadinimas: SpeedStack
Dalies Nr., kitokios klasifikacijos numeriai: 171450-5114 01714505114
Rasta produktų:
Norėdami rodyti panašius produktus, pažymėkite bent vieną langelį
Pasirinkite bent vieną žymimąjį langelį, kad būtų rodomi panašūs šios kategorijos produktai.
Pasirinkti atributai: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

SpeedStack Mezzanine Connector System

Molex SpeedStack Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40Gbps per differential pair. With mated stack heights of 4mm to 10mm with a 0.80mm pitch, these connectors provide design flexibility for PCB space-constrained applications. The narrow housing design minimizes airflow obstructions and promotes system cooling. Molex SpeedStack Mezzanine Connector System utilizes a split-pad PCB design that allows for electrical tuning performance and provides edge card compatibility. The robust insert-molded wafer design with protected shrouded housing supports the terminal location to improve electrical balance within the signals for low-profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes crosstalk. 

SpeedMezz Connector Family

Molex SpeedMezz Connector Family offers high densities, low profiles, data rates up to 56Gbps per differential pair. These products provide easy upgrading with common receptacle footprints. Molex SpeedMezz Connector Family delivers versatile solutions for high-speed mezzanine, rugged edge card, and lower speed applications.