170814-0039

Molex
538-170814-0039
170814-0039

Gam.:

Aprašymas:
Plokščių ir tarpinės jungtys NeoScale High-Speed Mezzanine Receptacle, 2.80mm Pitch, 4x18, 72 Triads-85 Ohm 216 Ckts , 8.00mm

Eksploatacijos Laikotarpis:
Specialus užsakymas gamykloje:
Gaukite pasiūlymą, kad patikrintumėte esamą kainą, užsakymo įvykdymo laiką ir užsakymo reikalavimus gamintojui.
ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas

Turime sandėlyje:

Produkto Požymis Atributo vertė Pasirinkite Požymį
Molex
Gaminio kategorija: Plokščių ir tarpinės jungtys
RoHS:  
170814
Tray
Prekės Ženklas: Molex
Gaminio tipas: Board to Board & Mezzanine Connectors
Gamyklinės pakuotės kiekis: 20
Subkategorija: Board to Board & Mezzanine Connectors
Prekinis pavadinimas: NeoScale
Dalies Nr., kitokios klasifikacijos numeriai: 1708140039 01708140039
Rasta produktų:
Norėdami rodyti panašius produktus, pažymėkite bent vieną langelį
Pasirinkite bent vieną žymimąjį langelį, kad būtų rodomi panašūs šios kategorijos produktai.
Pasirinkti atributai: 0

Reglamentavimo kodai
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99
Klasifikacija pagal kilmę
Kilmės šalis:
Singapūras
Šalis, kurioje pagaminta:
Ne
Distribucijos šalis:
Ne
Šalis gali keistis siuntimo metu.

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.