C1206X824K5RACTU

KEMET
80-C1206X824K5R
C1206X824K5RACTU

Gam.:

Aprašymas:
Daugiasluoksniai Keraminiai Kondensatoriai MLCC - SMD/sMT 50V 0.82uF X7R 1206 10%

ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas: 2 311

Turime sandėlyje:
2 311 Galime išsiųsti iš karto
Gamintojo numatytas pristatymo laikas
16 Savaičių Apytikriai apskaičiuotas gamybos laikas gamykloje, jei dalių kiekis didesnis nei nurodyta.
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:
Pakuotė:
Visa Ritė (Užsakoma po 2500)

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
Nukerpama juosta / „MouseReel™“
0,585 € 0,59 €
0,393 € 3,93 €
0,268 € 26,80 €
0,22 € 110,00 €
Visa Ritė (Užsakoma po 2500)
0,22 € 550,00 €
0,216 € 1 080,00 €
0,213 € 2 130,00 €
0,21 € 5 250,00 €
† 5,00 € „MouseReel™“ mokestis bus pridėtas ir apskaičiuotas jūsų pirkinių krepšelyje. Visi „MouseReel™“ užsakymai neatšaukiami ir negrąžinami.

Produkto Požymis Atributo vertė Pasirinkite Požymį
KEMET
Gaminio kategorija: Daugiasluoksniai Keraminiai Kondensatoriai MLCC - SMD/sMT
RoHS:  
0.82 uF
50 VDC
X7R
10 %
1206
3216
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
3.3 mm (0.13 in)
1.6 mm (0.063 in)
1 mm (0.039 in)
General Type MLCCs
SMD Comm X7R Flex
Reel
Cut Tape
MouseReel
Prekės Ženklas: KEMET
Klasė: Class 2
Gamybos šalis: Not Available
Distribucijos šalis: Not Available
Kilmės šalis: MX
Pakuotė / Korpusas: 1206 (3216 metric)
Gaminio tipas: Ceramic Capacitors
Gamyklinės pakuotės kiekis: 2500
Subkategorija: Capacitors
Tipas: Surface Mount Multilayer Ceramic Chip Capacitor
Prekinis pavadinimas: FT-CAP
Dalies Nr., kitokios klasifikacijos numeriai: C1206X824K5RAC7800
Vieneto Svoris: 27 mg
Rasta produktų:
Norėdami rodyti panašius produktus, pažymėkite bent vieną langelį
Pasirinkite bent vieną žymimąjį langelį, kad būtų rodomi panašūs šios kategorijos produktai.
Pasirinkti atributai: 0

TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
BRHTS:
85322410
ECCN:
EAR99

Group Power Conversion Components

YAGEO Group (YAGEO, Pulse, KEMET) designs passive component technologies that are critical in power conversion systems, including safety, snubber, and DC link capacitors; current sense and power resistors; and magnetic components such as transformers, common mode chokes, and inductors. Because every electronic device requires power, a vast majority of these products utilize a form of power conversion or power supply to deliver the required energy. 

Flexible Termination MLCCs

KEMET Flexible Termination technology is utilized in several series of surface-mount Multilayer Ceramic Chip Capacitors (MLCCs). These capacitors were developed to address flex cracks, the industry's primary failure mode for MLCCs. The Flexible termination directs circuit board stress away from the ceramic body and into the termination area. These MLCCs reduce the risk of mechanical damage to the component that can result in low IR and short circuit failures.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology. 

High CV Multilayer Ceramic Capacitors (MLCCs)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection.