C0603X102J1RALTU

KEMET
80-C0603X102J1RALTU
C0603X102J1RALTU

Gam.:

Aprašymas:
Daugiasluoksniai Keraminiai Kondensatoriai MLCC - SMD/sMT 100V 1000pF 0603 X7R 0.05

ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas

Turime sandėlyje:
Ne Sandėlyje Esantys
Gamintojo numatytas pristatymo laikas
52 Savaičių Apytikriai apskaičiuotas gamybos laikas gamykloje.
Pranešama apie ilgą šio gaminio pristatymo laiką.
Min. 4000   Užsakoma po 4000
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:
Šis Produktas Siunčiamas NEMOKAMAI

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
Visa Ritė (Užsakoma po 4000)
0,426 € 1 704,00 €

Panašūs produktai

Produkto Požymis Atributo vertė Pasirinkite Požymį
KEMET
Gaminio kategorija: Daugiasluoksniai Keraminiai Kondensatoriai MLCC - SMD/sMT
RoHS:  
REACH - SVHC:
1000 pF
100 VDC
X7R
5 %
0603
1608
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
1.6 mm (0.063 in)
0.8 mm (0.031 in)
0.8 mm (0.031 in)
General Type MLCCs
SMD Comm X7R Flex
Reel
Prekės Ženklas: KEMET
Klasė: Class 2
Pakuotė / Korpusas: 0603 (1608 metric)
Gaminio tipas: Ceramic Capacitors
Gamyklinės pakuotės kiekis: 4000
Subkategorija: Capacitors
Tipas: Surface Mount Multilayer Ceramic Chip Capacitor
Prekinis pavadinimas: FT-CAP
Dalies Nr., kitokios klasifikacijos numeriai: C0603X102J1RAL7867
Vieneto Svoris: 6,300 mg
Rasta produktų:
Norėdami rodyti panašius produktus, pažymėkite bent vieną langelį
Pasirinkite bent vieną žymimąjį langelį, kad būtų rodomi panašūs šios kategorijos produktai.
Pasirinkti atributai: 0

Kad ši funkcija veiktų, reikia įjungti „JavaScript“.

Reglamentavimo kodai
TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532400000
BRHTS:
85322410
ECCN:
EAR99
Klasifikacija pagal kilmę
Kilmės šalis:
Meksikas
Šalis, kurioje pagaminta:
Ne
Distribucijos šalis:
Ne
Šalis gali keistis siuntimo metu.

Group Power Conversion Components

YAGEO Group (YAGEO, Pulse, KEMET) designs passive component technologies that are critical in power conversion systems, including safety, snubber, and DC link capacitors; current sense and power resistors; and magnetic components such as transformers, common mode chokes, and inductors. Because every electronic device requires power, a vast majority of these products utilize a form of power conversion or power supply to deliver the required energy. 

Flexible Termination MLCCs

KEMET Flexible Termination technology is utilized in several series of surface-mount Multilayer Ceramic Chip Capacitors (MLCCs). These capacitors were developed to address flex cracks, the industry's primary failure mode for MLCCs. The Flexible termination directs circuit board stress away from the ceramic body and into the termination area. These MLCCs reduce the risk of mechanical damage to the component that can result in low IR and short circuit failures.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology. 

High CV Multilayer Ceramic Capacitors (MLCCs)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection.