140-510-415-100

EDAC
587-140-510-415-100
140-510-415-100

Gam.:

Aprašymas:
Kolektorių ir Laidų Korpusai 140 Series Wire to Board in-line 2.0mm pitch connector with 10 P.C. board through hole contacts, side entry

ECAD modelis:
Atsisiųskite nemokamą Library Loader, kad galėtumėte konvertuoti šį failą darbui su ECAD įrankiu. Sužinokite daugiau apie ECAD Modelį.

Prieinamumas: 963

Turime sandėlyje:
963 Galime išsiųsti iš karto
Min. 1   Užsakoma po 1
Vieneto kaina:
-,-- €
Plėt. Kaina:
-,-- €
Numatomas Įkainis:

Kainodara (EUR)

Qty. Vieneto kaina
Plėt. Kaina
0,353 € 0,35 €
0,314 € 3,14 €
0,279 € 6,98 €
0,259 € 25,90 €
0,217 € 54,25 €
0,175 € 175,00 €
0,169 € 422,50 €
0,163 € 1 630,00 €
0,159 € 3 180,00 €

Produkto Požymis Atributo vertė Pasirinkite Požymį
EDAC
Gaminio kategorija: Kolektorių ir Laidų Korpusai
RoHS:  
Headers
Shrouded
10 Position
2 mm (0.079 in)
1 Row
PCB Mount
Solder Pin
Right Angle
Pin (Male)
Tin
140
Wire-to-Board
- 40 C
+ 105 C
Prekės Ženklas: EDAC
Contact medžiaga: Brass
Dabartinė klasė: 2 A
Degumo įvertinimas: UL 94 V-0
Korpuso spalva: Natural
Korpuso medžiaga: Polyamide (PA)
Izoliacijos Atsparumas: 1 GOhms
Gaminio tipas: Headers & Wire Housings
Gamyklinės pakuotės kiekis: 1
Subkategorija: Headers & Wire Housings
Nurodytoji įtampa: 100 V
Rasta produktų:
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Pasirinkti atributai: 0

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USHTS:
8536694040
ECCN:
EAR99

140 Series 2mm Wire-to-Board Connectors

EDAC 140 Series 2mm Wire-to-Board Connectors are available in various positions with top-entry or side-entry configurations. Additional variations include right-angle, vertical, and SMT or through-hole mounted to the PCB. These inline connectors are designed for the high-density connection of internal wires to PCBs with a thickness of 1.2mm to 1.6mm. They have a 2A current rating and a low-profile insulator body with a 6.1mm height and 4.70mm width. They operate in a -40°C to +105°C temperature range. EDAC 140 Series 2mm Wire-to-Board Connectors are compatible with leading industry connectors as drop-in replacements and ideal for use in wire harness applications.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.